Affiliation: | 1. Department of Mechanical Engineering, National Cheng Kung University, Tainan 701, Taiwan;2. Advanced Semiconductor Engineering, Inc. 26 Chin 3rd Rd., Nantze Export Processing Zone, Kaohsiung 811, Taiwan;1. Moscow Engineering Physics Institute (NRNU “MEPhI”), Moscow, Russia;2. Centro Nacional de Microelectrónica (CNM, CSIC), Barcelona, Spain;3. Santa Cruz Institute for Particle Physics (SCIPP, UCSC), Santa Cruz, CA, USA;4. Lawrence Berkeley National Laboratory (LBNL), Physics Division, Berkeley, CA, USA;5. Brookhaven National Laboratory (BNL), Upton, NY, USA;6. University of Pennsylvania, Philadelphia, PA, USA;1. Politecnico di Torino, Dipartimento di Automatica e Informatica, Torino, Italy;2. Universidade Federal do Rio Grande do Sul (UFRGS), Porto Alegre, Brazil;1. Aselsan, Mehmet Akif Ersoy Mahallesi 296, 16, 06370 Yenimahalle, Ankara, Turkey;2. Universidad Antonio de Nebrija, C/Pirineos, 55 E-28040 Madrid, Spain;1. Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China;2. Department of Electrical & Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong |