从用户角度看芯片贴装头技术

现代制造商一直特别看重在变动过程中迅速重新配置平台型贴装机的灵活性,以便能够对变动后的产品实现最优的贴装能力.现在,平台型贴装设备上提供的新一代贴装头技术扩展了这些系统的能力,可以提供高速芯片贴装功能,实现能够在不需重新配置,不会影响精度、良品率或产能的情况下,贴装常用的各种元件.它能使未来几代装配商将从更加灵活、自适应和精确的贴装头中受益,他们将提高利用率,大大降低变动时间,明显减少支持高速度、低成本、快速交货周期制造环境所需的反应时间.

A User's Eye View of Chip Placement Head Technologies

Modern manufacturers have always valued the flexibility to quickly reconfigure platform-type machines during changeovers and thereby optimize placement capabilities for the incoming product.Now a new generation of head technologies available on platform-type placement equipment extends the reach of these capable systems to deliver high speed chip placement,and realize the ideal that the gamut of components in common usage should be placed without reconfiguration,and without sacrificing accuracy,yield,or throughput.As a result,future generations of assemblers will benefit from more flexible,self adapting,and accurate placement heads that enable greater utilization,much reduced changeover time and deliver significant reductions in tact time to support high-speed,low-cost,fast turnaround manufacturing.