| 铜粉处理酸性镀铜溶液中氯离子的机理 |
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| 引用本文： | 郭崇武. 铜粉处理酸性镀铜溶液中氯离子的机理[J]. 电镀与精饰, 2011, 33(6): 20-22 |
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| 作者姓名： | 郭崇武 |
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| 作者单位： | 广州超邦化工有限公司; |
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| 摘 要： | 阐明了用铜粉处理酸性镀铜溶液中氯离子的机理,理论分析和实验表明,在酸性镀铜溶液中,Cu2+离子与铜粉反应生成Cu+离子,同时氯离子与Cu+离子反应生成氯化亚铜沉淀.向镀液中加铜粉1g/L,氯离子的起始质量浓度为174mg/L时,氯离子的去除率为58.9%,而向镀液中加锌粉1g/L,氯离子的去除率为47.0%,用铜粉处理...
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| 关 键 词： | 酸性镀铜 氯离子 铜粉 处理机理 |
Mechanism of Treating Chloride Ion in Acidic Copper Plating Bath with Copper Powder |
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| GUO Chong-wu. Mechanism of Treating Chloride Ion in Acidic Copper Plating Bath with Copper Powder[J]. Plating & Finishing, 2011, 33(6): 20-22 |
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| Authors: | GUO Chong-wu |
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| Affiliation: | GUO Chong-wu(Guangzhou Ultra Union Chemicals Co.,Ltd.,Guangzhou 510460,China) |
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| Abstract: | The mechanism of treating chloride ion in acidic copper plating bath by using copper powder was illustrated.Theoretical analyses and experimental tests indicated that in acidic copper plating solution Cu2+ ion could react with copper powder to form Cu+ ion and the Cu+ ion could react with chloride ion in the solution to produce cuprous chloride precipitation.When the initial mass concentration of the chloride ions in the acidic copper plating solution was 174 mg/L,the elimination rate of chloride ions after... |
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| Keywords: | acidic copper plating chloride ion copper powder treatment mechanism |
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