| 电流密度对银纳米晶镀层微观结构及显微硬度的影响 |
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| 引用本文： | 王姗姗,祝要民,任凤章,赵士阳,田保红. 电流密度对银纳米晶镀层微观结构及显微硬度的影响[J]. 电镀与涂饰, 2011, 30(4): 5-8 |
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| 作者姓名： | 王姗姗 祝要民 任凤章 赵士阳 田保红 |
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| 作者单位： | 河南科技大学材料科学与工程学院;河南省有色金属材料科学与加工技术重点实验室; |
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| 基金项目： | 国家自然科学基金(50771042); 河南省基础与前沿技术研究计划(092300410064); 河南省科技创新人才计划(104100510005); 河南省高校科技创新人才支持计划(2009HASTIT023) |
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| 摘 要： | 在硫代硫酸盐体系(无氰)下电沉积制备了银纳米膜,研究了电流密度对电沉积银纳米膜的电流效率、结合强度、微观形貌、晶粒尺寸、织构及显微硬度的影响。镀液组成为:硝酸银44g/L,硫代硫酸钠220g/L,焦亚硫酸钾44g/L,醋酸铵30g/L,硫代氨基脲0.8g/L。结果表明:在电流密度为0.20～0.35A/dm2时,镀层与基体结合良好,电流效率随电流密度的增大而先增加再减小,(111)晶面的择优取向程度逐渐减弱,(222)晶面织构增强,晶粒尺寸略有增加,显微硬度稍有减小。
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| 关 键 词： | 银镀层 纳米晶 电流密度 电流效率 形貌 织构 显微硬度 |
Effect of current density on microstructure and microhardness of nanocrystalline silver film |
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| WANG Shan-shan,ZHU Yao-min,REN Feng-zhang,ZHAO Shi-yang,TIAN Bao-hong. Effect of current density on microstructure and microhardness of nanocrystalline silver film[J]. Electroplating & Finishing, 2011, 30(4): 5-8 |
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| Authors: | WANG Shan-shan ZHU Yao-min REN Feng-zhang ZHAO Shi-yang TIAN Bao-hong |
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| Affiliation: | WANG Shan-shan,ZHU Yao-min,REN Feng-zhang,ZHAO Shi-yang,TIAN Bao-hong School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China |
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| Abstract: | Nanocrystalline silver deposits were prepared by electrodeposition in a cyanide-free thiosulfate system.The bath composition is as follows:silver nitrate 44 g/L,sodium thiosulfate 220 g/L,potassium metabisulfite 44 g/L,ammonium acetate 30 g/L,and aminothiourea 0.8 g/L.The effect of current density on current efficiency,adhesion,morphology,grain size,structure and microhardness of Ag film was studied.The results showed that when the current density is increased from 0.20 to 0.35 A/dm2,the adhesion is good,th... |
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| Keywords: | silver deposit nanocrystalline current density current efficiency morphology structure microhardness |
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