注射成型参数对微结构阵列导光板翘曲量的影响

为研究不同的工艺参数对微结构阵列导光板翘曲变形的影响,以微结构阵列导光板的翘曲量为质量目标,利用MoldFlow MPI5,仿真研究了不同工艺参数下,尺寸规格为11 mm×3 mm×0.8 mm导光板的翘曲变形。采用正交实验法找出影响微结构阵列导光板翘曲变形最小参数组合,然后采用单因素法仿真研究不同工艺参数对微结构阵列导光板翘曲变形的影响。结果表明,保压压力对微结构阵列导光板翘曲变形的贡献率最大(60.19％),其次是注射时间(13.13％),成型工艺参数对微结构阵列导光板翘曲量的影响顺序为:保压压力>注射时间>保压时间>熔体温度>冷却时间。结果表明,在微结构阵列导光板注射成型阶段,就应考虑不同工艺参数对微结构导光板注射成型翘曲变形的影响,并优先考虑保压压力的设置,以减少微结构阵列导光板微注射成型的翘曲量。

Effect of injection molding processing parameters on light guide plate with microsturcture array

The influence of different processing parameters on the warpage and deformation of a 11 mm×3 mm×0.8 mm light guide plate with microstructure array was simulated by the MoldFlow MPI5. The optimized parameter of each factor’s contribution to the light guide plate with microstructure array was studied with orthogonal experimental method, and then the single factor experimental method was utilized to study the effect of different processing parameters on the warpage and deformation of the light guide plate with microstructure array. The results show that holding pressure contributes the most to the warpage and deformation (60.19%), and the injection time is the second one (13.13%). The single factor experimental simulation shows that the influence degree of process parameters on warpage can be ordered in pressure> injection time >holding time>melt temperature>cooling time. Therefore, the influence of different processing parameters on the injection molding of the light guide plate should be considered in priority, especially the holding pressure’s setting.