轻质高导电镀银复合粒子的制备研究

采用分散聚合工艺,以聚乙烯吡咯烷酮为分散剂,偶氟二异丁腈为引发剂,无水乙醇为分散介质,制备出粒径2.0μm、表面光滑、分散均匀的聚苯乙烯微球.将其进行表面磺化处理后运用化学镀工艺制备出了具有轻质高导电特性的聚苯乙烯/银复合粒子.对所制备的复合粒子进行了扫描电镜、红外光谱以及体积电阻率的测试.结果表明:所制备的复合粒子包覆均匀、导电性能良好；表面修饰提高了PS微球表面的电负性和亲水性并引入了磺酸基团,对PS微球表面镀银起到了重要作用;另外,随着PdCl2浓度和AgNO3/PS质量比的增加,复合粒子包覆完整性和导电性能都随之增加,最佳体积电阻率为1.61×10 -4Ω·cm.

The effect of surface modification on the preparation and properties of Ag/PS composite particles

The polystyrene microspheres with the average size of 2.0μm were prepared by the dispersion polymerization technique in the presence of polyvinylpyrrolidone.Furthermore,the Ag/PS composite particles were prepared by the electroless plating method,in which the silver particles were formed on the surface of PS microspheres after surface modification.Moreover,the effect of surface modification on the preparation and electrical properties of Ag/PS composite particles was investigated in detail.These results showed that the surface modification of PS was very important for the formation and improvement of conductivity of Ag/PS core-shell structure due to the introduction of sulfonic acid groups,which enhanced the electro-negativity and hydrophilicity of PS miscrospheres.Besides,with the increase of the concentration of palladium chloride and the quality ratio of silver nitrate/polystyrene,the conductivity of composite particles was increased,in which the high conductivity(1.61×10-4Ω·cm) was obtained.