Vacuum metallization of polyetherimide: Interfacial chemistry and adhesion

Vacuum deposition of metal coatings on polyetherimide was investigated. High levels of adhesion (>170 g/mm) with evaporated copper were achieved through a primarily chemical interaction. Changes in the interfacial chemistry were correlated with metal/polymer adhesion. Vacuum deposition of aluminum onto polyetherimide was also examined and found to yield much lower adhesion.