飞片冲击载荷在环氧树脂/印刷电路板/环氧树脂界面处的传递特性

为提高弹载电路系统的抗冲击性，开展平面冲击载荷在电路灌封系统内典型界面处的传递特性研究。从试验、理论和仿真角度出发，对冲击载荷在环氧树脂/印刷电路板（PCB）/环氧树脂界面间的传递变化过程进行分析。以轻气炮为试验平台，通过多重埋入式应力传感器测得冲击载荷在界面间的变化过程；以应力波理论为基础，对应力波在多重界面间的入射、反射和透射特性进行分析，并考虑其在黏性介质中的衰减特性，计算求得冲击载荷在此种界面处传递的近似理论结果；结合文献［16］成果，对试验过程进行验证仿真。结果表明：理论、仿真结果与实测数据吻合良好；沿应力波传播方向，PCB背面处的载荷更小，更适宜放置关键元器件。

Transmission Characteristics of Impact Load of Flying Debris at Epoxy Resin/printed Circuit Board/epoxy Resin Interfaces

The transmission characteristics of in-plane impact load of flying debris at the typical interfaces in a encapsulated circuit system are studied to improve the impact resistance of missile-borne circuit system. The transfer process of impact load at epoxy resin/PCB/epoxy resin interfaces is analyzed from the perspective of experiment， theory and simulation.The variation processes of impact load at the interfaces are measured using the multiple embedded stress sensors.Depending on the theory of stress wave propagation，the incident，reflective and transmission characteristics of shock wave at those interfaces are analyzed，and the attenuation characteristics of shock wave in the viscous medium are considered. The approximate theoretical results of transmission of impact load at the interfaces were obtained through calculation.The experimental results were verified by numerical simulation，combined with the results in Ref.［16］. The theoretical and simulated results agreed well with the measured data.The results show that the overload at the back of PCB is smaller along the direction of stress wave propagation.