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Modeling and simulation of thermal fatigue crack in EB-PVD TBCs under non-uniform temperature
Affiliation:1. Key Laboratory of Key Film Materials & Application for Equipment (Hunan province), School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China;2. Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China;3. College of Engineering, Peking University, Beijing 100871, China
Abstract:Demand for enhanced jet engine efficiencies has led to a significant increase in the combustion temperature. Thus protecting components against the combustion products is necessary and is possible by using thermal barrier coatings (TBCs). In this research, thermal fatigue and creep interaction are studied via analytical and numerical finite element methods. Thermal stress and crack propagation analyses in the ceramic top coat are carried out based on plane stress condition and under inhomogeneous temperature distribution across the layers. The crack is assumed as a penny-shaped crack in both vertical and inclined growth directions. The study proposed that the creep-plasticity results in thermal stress alleviation and the tensile stress transforms into a compressive stress of − 200 MPa in forwarding cycles that will induce crack closure. In addition, the results confirmed that vertical cracks grow much faster than oblique ones due to single mode crack propagation and about 0.14 MPa√m greater values in stress intensity factor. The modeling and simulation results match together, and the obtained crack behavior is in compliance with other researcher's output.
Keywords:Thermal barrier coating  Thermal fatigue  Creep  Crack  Stress intensity factor
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