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室温固化高剥离强度、耐中/低温环氧结构胶的研究
引用本文:姚其胜,陆企亭. 室温固化高剥离强度、耐中/低温环氧结构胶的研究[J]. 上海化工, 2012, 37(6): 13-15
作者姓名:姚其胜  陆企亭
作者单位:上海康达化工新材料股份有限公司,上海,201201
摘    要:制备了一种室温固化,具有韧性的耐中/低温、高剥离强度、高剪切强度的改性环氧结构胶,并对其进行了性能测试,结果表明该环氧结构胶对多种材料具有良好的粘接性能。

关 键 词:室温固化  剥离强度  环氧树脂

Study on Room Temperature Curing Epoxy Structure Adhesive with High Peeling Strength and Middle-low-temperature Resistant
Yao Qisheng Lu Qiting. Study on Room Temperature Curing Epoxy Structure Adhesive with High Peeling Strength and Middle-low-temperature Resistant[J]. Shanghai Chemical Industry, 2012, 37(6): 13-15
Authors:Yao Qisheng Lu Qiting
Affiliation:Yao Qisheng Lu Qiting
Abstract:A modified room temperature curing epoxy structural adhesive with high peeling strength, high shear strength, middle/low temperature resistance, and toughness was prepared, and performance test was carried out. The results showed that the epoxy structural adhesive appeared good adhesion with multiple materials.
Keywords:Room temperature curing  Peeling strength  Epoxy resin
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