| 3D模块金丝键合在线检测技术研究 |
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| 引用本文： | 李孝轩,许立讲,纪乐,严伟,严仕新. 3D模块金丝键合在线检测技术研究[J]. 电子工业专用设备, 2010, 39(12): 31-34 |
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| 作者姓名： | 李孝轩 许立讲 纪乐 严伟 严仕新 |
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| 作者单位： | 南京电子技术研究所,江苏,南京,210039;苏州德天光学技术有限公司,江苏,苏州,215124 |
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| 摘 要： | 对金丝键合后键合质量的在线自动快速光学检测的原理、建模和检测成功率进行了概述,同时通过具体案例对金丝键合质量在线检测技术进行了研究。解决了键合质量的自动化在线检测的工程应用,对稳定3D微组装的键合质量起到积极的作用。
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| 关 键 词： | 键合 多芯片模块 在线检测 |
Online Detection Technology of Gold Wire Bonding in the 3D Modules |
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| LI Xiaoxuan,XU Lijiang,JI Le,YAN Wei,YAN Shixin. Online Detection Technology of Gold Wire Bonding in the 3D Modules[J]. Equipment for Electronic Products Marufacturing, 2010, 39(12): 31-34 |
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| Authors: | LI Xiaoxuan XU Lijiang JI Le YAN Wei YAN Shixin |
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| Affiliation: | LI Xiaoxuan1,XU Lijiang1,JI Le1,YAN Wei1,YAN Shixin2 (1.Nanjing Research Institute of Electronics Technology,Nanjing 210013,China,2.Suzhou detain optical technology co.,LTD,Suzhian 215124,China) |
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| Abstract: | Gold wire-bonding is the key process in 3D module packaging.In this paper,an online detection technology of gold wire bonding was summarized.The quality and bonding ratio of the gold wire was studied in some cases through Automatic Optical Inspection(AOI) system.The result indicates that the system can meet the demands of online detection of 3D assembly and play a positive role in wire bonding quality. |
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| Keywords: | Bonding Multi-chip module Online detection |
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