| 高速电路的电磁兼容分析与设计 |
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| 引用本文： | 周志近. 高速电路的电磁兼容分析与设计[J]. 山西电子技术, 2010, 0(6): 19-20,41 |
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| 作者姓名： | 周志近 |
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| 作者单位： | 南京信息职业技术学院,江苏南京210046 |
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| 摘 要： | 设计的线路板首要任务是能够正常工作,但如今PCB板的层数越来越高,厚度越来越薄,线宽、线间距等越来越小,出现电磁干扰等影响印制板的质量的因素层出不穷。基于此主要探讨电磁兼容产生的因素、电磁兼容产生的要素并对相应的解决问题的方法进行详细分析与探讨。
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| 关 键 词： | 电磁兼容 高速电路 电磁干扰 |
Analysis and Design on the Electromagnetic Compatibility of High-speed Circuit |
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| Zhou Zhi-jin. Analysis and Design on the Electromagnetic Compatibility of High-speed Circuit[J]. Shanxi Electronic Technology, 2010, 0(6): 19-20,41 |
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| Authors: | Zhou Zhi-jin |
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| Affiliation: | Zhou Zhi-jin(Nanjing College of Information Technology,Nanjing Jiangsu 210046,China) |
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| Abstract: | The first task of design for the circuit board is to work properly.But now more and more layers is appeared on PCB board,the thickness is getting thinner and thinner,the line width and line spacing is smaller and smaller,the electromagnetic interference factors that effects the quality of PCB is coming one after another.This article explores the factors and elements that generate electromagnetic compatibility,and analyzes and discusses in details the appropriate solution to the problem. |
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| Keywords: | EMC high-speed circuit EMI |
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