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高性能低烧BZN基多层陶瓷电容器电镀工艺研究
引用本文:杜慧玲,汪宏,姚熹.高性能低烧BZN基多层陶瓷电容器电镀工艺研究[J].功能材料,2000,31(4):398-400.
作者姓名:杜慧玲  汪宏  姚熹
作者单位:西安交通大学电子材料与器件研究所,陕西,西安,710049
基金项目:国家科委“863”计划资助项目
摘    要:本文探讨了电镀工艺对BZN基多层陶瓷电容器(MLC)电性能的影响。根据镀前、镀后MLC电性能的明显差异,结合MLC微观形貌及微区能谱分析,认为镀后MLC电性能劣化的根本原因是MLC本身端电极缺陷,电镀液渗入MLC内部,有机成分的存在,使其性能劣化。

关 键 词:BZN基MLC电镀工艺  镀锡  镀镍
文章编号:1001-9731(2000)04-0398-03
修稿时间:1999-05-03

Electro-Plating Technology of High Performance Low Sintering BZN Based MLC
DU Huiling,WANG Hong,YAO Xi.Electro-Plating Technology of High Performance Low Sintering BZN Based MLC[J].Journal of Functional Materials,2000,31(4):398-400.
Authors:DU Huiling  WANG Hong  YAO Xi
Affiliation:DU Huiling ,WANG Hong ,YAO Xi (Electronic Materials Research Laboratory,Xi'an Jiaotong University, Xi'an ,710049,China)
Abstract:Effect of electro- plating technology on BZN based multilayer capacitor (MLC) was studied According to the distinct differs of properties before and after electro- plating. combining with the micrograph and line-scanning energy spectrum, it showed that the basic rea- son of property reduction was the defect of termination itself, inner of MLC was corroded by organic ingredient of infiltrated liquid during plating
Keywords:BZN based MLC  electro-plating technology  Ni- Plating  Sn-plating  
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