Influence of a liquid structural change on the solidification of the alloy CuSn30 |
| |
Authors: | Jie Chen Fang-Qiu Zu Xian-Fen Li Guo-Hua Ding Hon-Sheng Chen Li Zou |
| |
Affiliation: | (1) Liquid/Solid Metal Processing Institute, School of Materials Science and Engineering, Hefei University of Technology, 230009 Hefei, P. R. China |
| |
Abstract: | The effect of a liquid structural change on the solidification of the alloy CuSn30 is discussed. The temperature dependence
of the electrical resistivity (ρ-T) of a CuSn30 (wt.%) melt was measured, and an abnormal change was found on the ρ-T curve
within a range of 855°C to 1040°C, which suggests that the melt may have undergone a temperature-induced liquid-liquid structural
transition (TI-LLST). The existence of the TI-LLST was verified by means of differential scanning calorimetry. Furthermore,
the melt that experienced the TI-LLST needed higher undercooling to nucleate, and the eventual grain size was evidently refined.
Analysis of the atomic bonding mechanism of the CuSn30 melt at temperatures above melting point suggest that the structural
transition can be attributed to the destruction of the inherited chemical short-range orders or clusters, and that this destruction
alone results in the homogeneity of the melt. In turn, the homogeneity of the melt inhibits the nucleation and growth of the
primary phase, promotes a peritectic reaction, and eventually refines the solidification microstructures. |
| |
Keywords: | liquid-liquid structural transition CuSn30 alloy chemical short-range orders grain refinement |
本文献已被 SpringerLink 等数据库收录! |
|