SiCp表面化学镀铜工艺研究

SiCp因其高强度、高模量、耐热、耐磨、耐高温等性能而被作为颗粒增强体制备金属基复合材料。本文用正交法优化了SiCp表面化学镀铜工艺，获得了Cu包覆SiCp，测定了SiCp的增重百分率及镀液的PH值随时间的变化规律，并对镀覆层形貌进行了SEM考察，结果表明，镀液的PH值及Ni^2 浓度对镀速影响最为显著；粒子分散很好、镀层均匀。

Study on the Process ofElectroless Copper Plating on SiCp

Because of its excellent properties, such a s high strength, highmodule, wear resisting, etc, SiCp is added to metal-matrix composite as a reinforce particle. In this present work, the process of electroless copper plating on SiCp was optimized with orthogonal experiments, and SiCp covered with electroless co pper coating was obtained. The relationship between the increasing mass percenta ge of SiCp, the pH value of the bath and the time was studied, meanwhile, the su rface morphology of deposited coating was measured by scanning electron microsco pe (SEM). As the results show, the pH value and the concentration of Ni2+ have a strong influence on the deposition rate, the particles are fine dispersed, and the surface of deposited coating is uniform.