This paper describes a 32-bank 1 Gb DRAM achieving 1 Gbyte/s (500 Mb/s/DQ pin) data bandwidth and the access time from RAS of 31 ns at V cc=2.0 V and 25°C. The chip employs (1) a merged multibank architecture to minimize die area; (2) an extended small swing read operation and a single I/O line driving write scheme to reduce power consumption; (3) a self-strobing I/O schemes to achieve high bandwidth with low power dissipation; and (4) a block redundancy scheme with increased flexibility. The nonstitched chip with an area of 652 mm 2 has been fabricated using 0.16 μm four-poly, four-metal CMOS process technology