| 快速凝固高强高导铜合金的研究现状及展望 |
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| 引用本文： | 张瑞丰,沈宁福.快速凝固高强高导铜合金的研究现状及展望[J].材料科学与工程学报,2001,19(1):148-152. |
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| 作者姓名： | 张瑞丰 沈宁福 |
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| 作者单位： | 郑州工业大学材料研究中心, |
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| 摘 要： | 本文综述了快速凝固高强度高导电率铜合金的研究现状 ,并对将来的发展趋势作了展望。指出 ,快速凝固铜合金的凝固过程对合金的最终显微组织结构起重要作用 ,因而 ,对其进行深入细致的研究具有重要意义。
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| 关 键 词： | 铜合金 高导 高强 快速凝固 |
| 文章编号： | 1004-793X(2001)01-0143-05 |
| 修稿时间： | 2000年8月15日 |
Review and Prospect of Researches on Rapidly Solidified High-strength High-conductivity Copper Alloys |
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| ZHANG Rui-feng,SHEN Ning-fu.Review and Prospect of Researches on Rapidly Solidified High-strength High-conductivity Copper Alloys[J].Journal of Materials Science and Engineering,2001,19(1):148-152. |
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| Authors: | ZHANG Rui-feng SHEN Ning-fu |
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| Abstract: | This paper has made a present situation review and a future development prospect of researches on rapidly solidified high strength and high conductivity copper alloys.It is pointed out that rapidly solidifcation process of copper alloys is a key factor to influence the final microstucture of alloys.Therefore,research on such field is very insignificant in the production of high strength and high conductiveity copper materials. |
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| Keywords: | Copper alloy high Conductivity high Strength rapid solidification |
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