| 低温镀铁时电流密度对镀层性能的影响 |
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| 引用本文： | 刘忆,杨森,殷锦捷,韩辉. 低温镀铁时电流密度对镀层性能的影响[J]. 电镀与涂饰, 2008, 27(2): 15-16 |
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| 作者姓名： | 刘忆 杨森 殷锦捷 韩辉 |
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| 作者单位： | 徐州工程学院机电分院,江苏,徐州,221008;辽宁工程技术大学材料系,辽宁,阜新,123000 |
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| 摘 要： | 研究了不同电流密度下所得低温镀铁层的沉积速率、显微硬度和腐蚀速率。结果表明,当电流密度为14A/dm2时镀层可获得最佳的综合性能。电流密度过低时,镀层沉积速率慢,硬度低;电流密度过高时,镀层表面出现针孔,厚度不均。
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| 关 键 词： | 镀铁工艺 低温 电流密度 沉积速率 显微硬度 耐蚀性 |
| 文章编号： | 1004-227X（2008）02-0015-02 |
| 收稿时间： | 2007-09-27 |
| 修稿时间： | 2007-10-12 |
Effect of current density on performances of deposit in low-temperature iron plating process |
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| LIU Yi,YANG Sen,YIN Jin-jie,HAN Hui. Effect of current density on performances of deposit in low-temperature iron plating process[J]. Electroplating & Finishing, 2008, 27(2): 15-16 |
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| Authors: | LIU Yi YANG Sen YIN Jin-jie HAN Hui |
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| Abstract: | The deposition rate, microhardness and corrosion rate of Fe coating prepared by low-temperature plating at different current densities were studied. The results showed that the Fe deposit obtained at 14 A/dm2 has optimal comprehensive performance. The Fe deposit prepared at too low current density has low deposition rate and micro- hardness, and that prepared at too high current density has pinholes on the surface with non-uniform thickness. |
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| Keywords: | iron plating process low temperature current density deposition rate microhardness corrosion resistance |
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