| Ag元素含量对Sn-Ag-Cu钎料焊接性的影响 |
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| 引用本文： | 刘洋,孙凤莲,王家兵.Ag元素含量对Sn-Ag-Cu钎料焊接性的影响[J].焊接学报,2011,32(4):25-28. |
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| 作者姓名： | 刘洋 孙凤莲 王家兵 |
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| 作者单位： | 哈尔滨理工大学材料科学与工程学院,哈尔滨,150040 |
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| 基金项目： | 国家自然科学基金资助项目，黑龙江省自然基金重点项目，哈尔滨市优秀学科带头人基金资助项目 |
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| 摘 要： | 以Sn-xAg-0.5Cu为基体制备了低银无铅钎料,其中Ag元素的质量分数分别为0.3%,0.5%,0.7%,0.9%.借助钎料合金的DSC熔化曲线,分析了Ag元素含量对合金熔点的影响规律.通过比较各组钎料合金在Cu基板上的铺展面积和铺展率,分析了Ag元素含量的变化对各组钎料润湿性的影响规律.结果表明,随着Ag元素含量...
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| 关 键 词： | 无铅钎料 熔点 润湿性 |
| 收稿时间： | 2009/12/11 0:00:00 |
Effect of Ag content on soldering ability of Sn-Ag-Cu solders |
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| LIU Yang,SUN Fenglian and WANG Jiabing.Effect of Ag content on soldering ability of Sn-Ag-Cu solders[J].Transactions of The China Welding Institution,2011,32(4):25-28. |
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| Authors: | LIU Yang SUN Fenglian and WANG Jiabing |
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| Affiliation: | College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China,College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China and College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China |
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| Abstract: | The influences of Ag content on melting temperature and wettability of Sn-xAg-0.5Cu(x=0.3,0.5,0.7,0.9) lead-free solder alloys were studied.The melting temperatures of alloys were compared by DSC(differential scanning calorimetry) curves and the wettability was compared by the area and rate of wetting on Cu substrate.The experimental results indicate that alloys with higher Ag content have lower melting points and melting range,and the content of Ag in solder alloys has a significant impact on the distribution and profile of the DSC curves.However,with the Ag content increasing,the wettability of the alloys degrades.By combining the two key properties of solder alloy,melting temperature and wettability,Sn-0.7Ag-0.5Cu shows higher performance. |
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| Keywords: | lead-free solder melting temperature wettability |
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