| 三种典型Sn-Ag-Cu无铅钎料的组织和性能研究 |
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| 引用本文： | 尹立孟,刘亮岐,杨艳. 三种典型Sn-Ag-Cu无铅钎料的组织和性能研究[J]. 电子元件与材料, 2010, 29(5). DOI: 10.3969/j.issn.1001-2028.2010.05.015 |
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| 作者姓名： | 尹立孟 刘亮岐 杨艳 |
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| 作者单位： | 重庆科技学院,冶金与材料工程学院,重庆,401331;华南理工大学,材料科学与工程学院,广东,广州,510640 |
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| 基金项目： | 重庆科技学院引进人才科研启动基金资助项目 |
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| 摘 要： | 对比研究了三种典型标称成分的Sn-Ag-Cu钎料(即日本JEIDA推荐的Sn-3.0Ag-0.5Cu、欧盟IDEALS推荐的Sn-3.8Ag-0.7Cu和美国NEMI推荐的Sn-3.9Ag-0.6Cu)的显微组织特征、熔化特性、润湿性以及钎焊接头微焊点的力学性能等。结果表明,三种钎料的组织和性能非常接近。然而从性价比等方面综合考虑,Sn-3.0Ag-0.5Cu为三种钎料中最具优势的替代传统Sn-Pb钎料(共晶和近共晶钎料)的无铅合金。
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| 关 键 词： | 电子封装 Sn-Ag-Cu钎料 显微组织 润湿性 力学性能 |
Study of microstructure and properties of three kinds of typical Sn-Ag-Cu lead-free solders |
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| YIN Limeng,LIU Liangqi,YANG Yan. Study of microstructure and properties of three kinds of typical Sn-Ag-Cu lead-free solders[J]. Electronic Components & Materials, 2010, 29(5). DOI: 10.3969/j.issn.1001-2028.2010.05.015 |
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| Authors: | YIN Limeng LIU Liangqi YANG Yan |
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| Abstract: | Microstructure,melting temperatures and wettability of three kinds of typical lead-free Sn-Ag-Cu solders,i.e.Sn-3.0Ag-0.5Cu recommended by JEIDA(Japan),Sn-3.8Ag-0.7Cu recommended by IDEALS(European Union) and Sn-3.9Ag-0.6Cu recommended by NEMI(USA),and the mechanical strength of solder joints of three kinds of alloys were investigated.Results show that there is no obvious difference among these three kinds of lead-free solders.However,Sn-3.0Ag-0.5Cu is the best one for the replacement of the traditional Sn-Pb solder for the sake of cost-effective consideration. |
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| Keywords: | electronic packaging Sn-Ag-Cu solder microstructure wettability mechanical property |
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