| 挠性PCB用基板材料的新发展（2）——三层型挠性覆铜板的开发新成果 |
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| 引用本文： | 祝大同.挠性PCB用基板材料的新发展（2）——三层型挠性覆铜板的开发新成果[J].印制电路信息,2005(3):14-18,34. |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京远创铜箔设备有限公司,100027 |
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| 摘 要： | 主要阐述2003年￣2004年FPC用挠性覆铜板在生产厂家方面及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。
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| 关 键 词： | 挠性印制电路板 挠性覆铜板 刚-挠性印制电路板 发展 |
The Newest Progress of Base Material used in Flexible PCB (2)--New Achievements of the Development of Three- layer Type FCCL |
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| Zhu Datong.The Newest Progress of Base Material used in Flexible PCB (2)--New Achievements of the Development of Three- layer Type FCCL[J].Printed Circuit Information,2005(3):14-18,34. |
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| Authors: | Zhu Datong |
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| Abstract: | In the paper, the manufacturer and the base material including PI film and copper foil in FPC were reviewed from 2003 to 2004. At the same, the development of technology and product was introduced. |
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| Keywords: | flexible printed circuit board(FPC) flexible copper clad laminate (FCCL) rigid- flex printed circuit board(R-FPC) progress |
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