| 不导电真空溅镀工艺与手机外壳表面处理 |
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| 引用本文： | 黄爱华,王强.不导电真空溅镀工艺与手机外壳表面处理[J].现代塑料加工应用,2008,20(5). |
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| 作者姓名： | 黄爱华 王强 |
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| 作者单位： | 1. 江西工业工程职业技术学院,江西萍乡,337055
2. 井冈山大学,江西吉安,343009 |
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| 摘 要： | 手机的外观装饰要求高,不导电真空溅镀工艺应用于其外壳的表面处理是项新工艺,具有很好的效果.通过分析不导电真空溅镀工艺的原理和特点,介绍了实际应用的生产工艺流程和要点.
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| 关 键 词： | 真空溅镀 表面处理 手机外壳 工艺 |
Non Conductive Vacuum Metallization Technics and Surface Treatment of Mobile Phone Crust |
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| Huang Aihua,Wang Qiang.Non Conductive Vacuum Metallization Technics and Surface Treatment of Mobile Phone Crust[J].Modern Plastics Processing and Applications,2008,20(5). |
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| Authors: | Huang Aihua Wang Qiang |
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| Affiliation: | 1.Jiangxi Vocational College of Industry and Engineering;Pingxiang;Jiangxi;337055;2.Jinggangshan University;Ji'an;343009 |
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| Abstract: | Mobile phone requests highly decorated appearance,and non conductive vacuum metallization technics applied to the surface treatment of mobile phone crust,which is a new technology with very good results.The principles and characteristic of non conductive vacuum metallization technics are analyzed.The technics and the main points during practical applications are introduced. |
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| Keywords: | non conductive vacuum metallization surface treatment mobile phone crust technics |
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