红外光电探测器的前沿热点与变革趋势

红外光电探测技术通常工作在无源被动的传感模式,具有作用距离远、抗干扰性好、穿透烟尘雾霾能力强、全天时工作等优点,在航天遥感、军事装备、天文探测等方面都有广泛应用。至今,二代、三代红外光电探测器已大规模进入装备,高端三代也在逐步推进实用化,并出现了前沿前瞻性的新概念、新技术、新器件。本文聚焦国内外的红外技术研究现状,重点介绍红外光电探测器当前的研究热点与未来的发展趋势。首先,介绍针对战术泛在化、战略高性能的SWaP³概念。其次,综述以超高空间分辨率、超高能量分辨率、超高时间分辨率、超高光谱分辨率为特征的高端三代红外光电探测器,分析挑战光强探测能力极限的红外探测器的技术特征与实现方法。然后,论述基于人工微结构的四代红外光电探测器,重点介绍偏振、光谱、相位等多维信息融合的实现途径与技术挑战。最后,从片上数字化升级为片上智能化的角度,探讨未来极具变革性趋势的红外探测器。

Recent hotspots and innovative trends of infrared photon detectors

Infrared photon detection technology usually works in the passive sensing mode and contains the advantages of long acting-distance,good anti-interference,excellent penetration of smoke and haze,and all-day operation,which has been widely used in space remote sensing,military equipment,astronomical detection and other aspects.So far,the second-generation and the third-generation infrared photon detectors have been deployed widely.The high-end third-generation infrared photon detectors have been gradually promoted to practical application.The fourth generation and more forward-looking research including new concept,new technology,and new device has been proposed.This paper focuses on the research status of infrared technology at home and abroad,emphatically introducing the hotspots and development trends of infrared photon detectors.Firstly,the concept of SWaP³is introduced due to tactical ubiquity and strategic high performance.Secondly,the high-end third-generation infrared photon detectors with ultra-high spatial resolution,ultra-high energy resolution,ultra-high time resolution and ultra-high spectral resolution are reviewed.Technical characteristics and implementation methods of ultimate-performance infrared detectors are analyzed.Then,the fourth-generation infrared photon detector based on the artificial micro-structure is discussed.The realization approaches and technical challenges of multi-dimensional information fusion such as polarization,spectrum and phase are mainly introduced.Lastly,highly innovative trends of future detectors are discussed according to upgradation from on chip digitization to on-chip intelligence.