半导体器件和集成电路水汽含量控制的研究

半导体器件和集成电路水汽含量偏高，会影响产品的电性能和可靠性。随着可靠性要求的提高，半导体器件和集成电路的内部水汽含量要求控制在5×10^-3以下。导致水汽含量偏高的原因有3个方面：一是壳体的密封性能差；二是预烘焙不够充分或封帽时控制不当：三是封帽时氮气的纯度不高。针对这3个方面因素分别提出了相应的解决办法，将封装产品的水汽含量稳定地控制在5×10^-3以下，一般内控指标要求在2×10^-3以下，才能保证产品批次性质量要求，从而提高产品的可靠性．

Research of Control Water Vapor in Semiconductor Devices and IC

High water vapor in semiconductor devices and integrate circuits will influence the product' s electrical characteristics and reliability. As the reliability of requirements increase, water vapor in semiconductor devices and integrate circuits need to be controlled less than 5000ppm. There are three ways which may bring on high water vapor: bad hermeticity of shell,no enough pre-baking or inap-propriate controlling of sealing,and impure nitrogen. Effective methods are put forward to resolve the problems above. By our efforts, the products'water vapor content was controlled below 5000ppm, usually 2000ppm. National military standard was satisfied and the products'reliability was improved. one is bad shell hermetic properties; one is baking not enough good and isn't controlled well when sealing; another is low nitrogen gas purity when sealing. Some effective solutions were introduced atabove given reasons. Finally, the products'water vapor is controlled under 5000ppm steadily. Commonly lower than 2000ppm. It is satisfied civilian standard requirements, increased the products reliability.