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Microstructure evolution of polycrystalline Ti2AlN MAX phase film during post-deposition annealing
Authors:Tao Wang  Zhe Chen  Guoqing Wang  Lei Wang  Guojun Zhang
Affiliation:School of Materials Science & Engineering, Xi’an University of Technology, Xi’an, 710048, China
Abstract:Polycrystalline Ti2AlN MAX phase films were fabricated by post-deposition annealing of Ti-Al-N film at annealing temperature in the range of 600?°C–800?°C in high vacuum. The temperature-dependent microstructure evolution from Ti-Al-N film to polycrystalline Ti2AlN film has been investigated. It was found that after post-deposition annealing above 600?°C, the as-deposited amorphous Ti-Al-N film transformed to polycrystalline Ti2AlN film. With the increase of annealing temperature from 600?°C to 700?°C, the crystallinity of polycrystalline Ti2AlN film was improved. At 800?°C, the surface Ti2AlN grains completely decomposed and transformed to TiN phase while inner grains was partial decomposed and surrounded by amorphous Al-rich phase. The polycrystalline Ti2AlN film exhibited a highest hardness of 34.1?GPa while the hardness of amorphous Ti-Al-N film was only 24.2?GPa. The mechanism of texture changes and phase transformation as well as its effect on thermal stability was also discussed.
Keywords:MAX phase  Thin films  Thermal stability
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