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DAS井地联合勘探实例分析——以长庆油田环县三维井地联采为例
引用本文:李彦鹏,刘学刚,王大兴,吴俊军,王艳华,陈策,李飞.DAS井地联合勘探实例分析——以长庆油田环县三维井地联采为例[J].石油物探,2022(1):112-121.
作者姓名:李彦鹏  刘学刚  王大兴  吴俊军  王艳华  陈策  李飞
作者单位:中国石油集团东方地球物理勘探有限责任公司;中国石油天然气股份有限公司长庆油田分公司
基金项目:中石油重大现场试验项目“光纤井中地震采集系统及配套技术现场试验”(2017F-15);中石油东方地球物理公司科研项目“井中DAS-VSP关键技术研究”(06-01-2021)共同资助。
摘    要:光纤分布式声波传感(DAS)技术因其耐高温高压和高密度全井段采集等技术优势使得井地联合勘探技术更加高效,在井驱参数提取及井旁成像等方面具有广泛的应用前景,但目前该技术面临记录数据的信噪比偏低、单分量数据波场分离困难、地面激发点稀疏造成照明不均匀和成像质量欠佳等技术难题。为此,系统分析了长庆油田珠60井的套管外DAS-VSP井地联采数据的采集质量及对处理结果的影响、DAS单分量波场特征及反射波分离、井驱参数提取、井地联合多次波分析、3D-VSP成像的技术优势和不足等,形成了高效初至拾取及井驱参数提取、单分量保真波场分离、扩展面元VSP CDP成像等一系列技术成果,提出了下一步的研究重点是将高密度优势转化为高信噪比,进一步提高波场分离保真度,并在处理中尽可能克服激发点稀疏的影响,以实现3D-VSP的精确成像,最终实现井地联合成像,这些结果对于今后的DAS井地联合勘探具有非常积极的指导意义。

关 键 词:光纤分布式声波传感  井地联采  井地联合处理  VSP  波场分离  扩展面元

DAS joint VSP and 3D surface seismic:A case study on HX3D in the Changqing oilfield
LI Yanpeng,LIU Xuegang,WANG Daxing,WU Junjun,WANG Yanhua,CHEN Ce,LI Fei.DAS joint VSP and 3D surface seismic:A case study on HX3D in the Changqing oilfield[J].Geophysical Prospecting For Petroleum,2022(1):112-121.
Authors:LI Yanpeng  LIU Xuegang  WANG Daxing  WU Junjun  WANG Yanhua  CHEN Ce  LI Fei
Affiliation:(BGP Inc.,CNPC,Zhuozhou 072751,China;Changqing Oilfield Company,CNPC,Xi'an 710021,China)
Abstract:Optical fiber distributed acoustic sensing(DAS)technology makes downhole-surface joint exploration more efficient because of its high temperature,high pressure resistance,and high-density whole-wellbore acquisition.It has been widely used in well-driven parameter estimation and near-well imaging,but it currently faces technical problems such as low signal-to-noise ratio,difficult wavefield separation due to one-component(1C)data,inhomogeneous illumination,and unsatisfactory imaging caused by sparse shot points.In this study,many issues were investigated,such as the acquisition quality and its influence on the processing of DAS VSP data with cemented fiber,separation of DAS 1C wavefield,well-driven parameter extraction,multiple reflection analysis,and technical advantages and weakness of 3D-VSP imaging.A series of technical achievements were presented,such as efficient first break picking,refined well-driven parameter extraction,high-fidelity 1C wavefield separation,and extended bin VSPCDP imaging.It has been pointed out that the emphases would achieve high S/N data from high-density raw data,further improving the wavefield separation fidelity,and overcoming the effect of shot point sparsity as much as possible in the processing,realizing 3D-VSP precision imaging,and finally achieving joint borehole and surface imaging.This understanding has very positive guidance for DAS joint VSP and surface seismic exploration in the future.
Keywords:DAS  joint borehole and surface seismic survey  joint processing of borehole and surface seismic  VSP  wavefield separation  extended bin
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