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| (Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7高熵陶瓷的制备及热物理性能 | |
| 引用本文： | 桑玮玮,张红松,陈华辉,温斌,李新春. (Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7高熵陶瓷的制备及热物理性能[J]. 无机材料学报, 2021, 36(4): 405-410. DOI: 10.15541/jim20200489 |
| 作者姓名： | 桑玮玮 张红松 陈华辉 温斌 李新春 |
| 作者单位： | 1.中国矿业大学(北京) 机电与信息工程学院, 北京 100083 2.河南工程学院 机械工程学院, 郑州 450019 |
| 基金项目： | 河南省高校科技创新团队(18IRTSHN005);河南省高等学校重点科研项目(20A5600008)。 |
| 摘 要： | 寻求具有良好热物理性能的新型陶瓷材料是热障涂层领域的研究热点之一.本研究采用固相反应法制备了(Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7高熵陶瓷材料,对其晶体结构、显微组织、元素分布、结构稳定性和热物理性能进行了研究.结果表明:制备的高熵陶瓷具有单一的缺陷萤石结构,元素分布均匀,晶粒尺寸在0.2～3μ... |
| 关 键 词： | 高熵陶瓷 热障涂层 热导率 热膨胀系数 |
| 收稿时间： | 2020-08-24 |
| 修稿时间： | 2020-10-05 |
Preparation and Thermophysical Properties of(Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7 High-entropy Ceramic |
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| SANG Weiwei,ZHANG Hongsong,CHEN Huahui,WEN Bin,LI Xinchun. Preparation and Thermophysical Properties of(Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7 High-entropy Ceramic[J]. Journal of Inorganic Materials, 2021, 36(4): 405-410. DOI: 10.15541/jim20200489 | |
| Authors: | SANG Weiwei ZHANG Hongsong CHEN Huahui WEN Bin LI Xinchun |
| Affiliation: | 1. School of Mechanical Electronic & Information Engineering, China University of Mining & Technology-Beijing, Beijing 10083, China 2. College of Mechanical Engineering, Henan University of Engineering, Zhengzhou 451191, China |
| Abstract: | Developing novel ceramic materials with excellent thermophysical properties is one of the hotspots in the field of thermal barrier coatings. The (Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7 high-entropy ceramic was fabricated via high-temperature solid-state reaction. The crystal structure, microstructure, phase stability and thermophysical properties were investigated. Results indicate that (Sm0.2Gd0.2Dy0.2Y0.2Yb0.2)3TaO7 high-entropy ceramic has single defective fluorite structure, its elements are homogenously distributed, its grain size ranges from 0.2 to 3 μm. After high-temperature thermal cycling, the sample still remains single fluorite structure, showing excelleent phase stability at high temperature. Thermal conductivity lies in the range of 0.72-0.74 W/(m·K), lower than that of 7YSZ. Thermal expansion coefficient at 1200 ℃ is 5.6×10-6 K-1, lower than requirement of thermal barrier coatings (TBCs) for surface ceramic layer. However, its thermal expansion coefficient is close to that of the silicon-based ceramics substrate of environmental barrier coatings (EBCs) ((3.4-5.5)×10-6 K-1). |
| Keywords: | high-entropy ceramic thermal-barrier coating thermal conductivity thermal expansion coefficient |
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