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等效厚度评估GaAs MMIC的Si3N4电容可靠性
引用本文:黄云,钮利荣,林丽.等效厚度评估GaAs MMIC的Si3N4电容可靠性[J].功能材料与器件学报,2004,10(4):484-488.
作者姓名:黄云  钮利荣  林丽
作者单位:电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610
摘    要:通过不同GaAs MMIC的MIMSi3N4电容结构,运用TDDB理论研究分析了斜坡电压下的MIM Si3N4电容的导电特性和击穿特性,确定了GaAs MMIC的MIM Si3N4电容失效不是介质本征击穿导致失效,而主要是由Si3N4介质的缺陷引起。基于缺陷导致介质电场击穿的原理,提出了等效厚度模型评估和监测GaAs MMIC的Si3N4介质电容的质量和可靠性的新方法,可以用于工艺生产线实现对Si3N4介质电容的质量和可靠性进行快速评估和监测。

关 键 词:Si3N4电容  等效厚度  评估  可靠性
文章编号:1007-4252(2004)04-0484-05
修稿时间:2004年2月13日

Reliability evaluation of Si3N4 capacitor of GaAs MMIC by equivalent thickness method
HUANG Yun ,NIU Li -rong ,LIN Li.Reliability evaluation of Si3N4 capacitor of GaAs MMIC by equivalent thickness method[J].Journal of Functional Materials and Devices,2004,10(4):484-488.
Authors:HUANG Yun  NIU Li -rong  LIN Li
Affiliation:HUANG Yun 1,NIU Li -rong 2,LIN Li 3
Abstract:The conductive and breakdown properties of MIM Si 3 N 4 capacitors of GaAs MMIC were studied and analyzed by TDDB theory.The dielectric defect is a major factor that c auses capacitor failure,instead of dielectric intrinsic bre akdown.Based on the principle of defects causing the dielectric breakdown of the electric field,the equivalent thickness model was prop osed to evaluate and monitor quality and reliability of Si 3 N 4 capacitor rapidly.
Keywords:Si_3N_4 capacity  equivalent thickness  ev aluate  reliability
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