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涡流法检测铝硅合金显微组织的误差分析
引用本文:曾辉,曾琪.涡流法检测铝硅合金显微组织的误差分析[J].无损检测,2004,26(7):372-374.
作者姓名:曾辉  曾琪
作者单位:1. 广东嘉应学院,电子信息工程系,广东,梅州,514015
2. 武汉大学,化学与分子科学学院,湖北,武汉,430072
摘    要:当采用涡流法检测铝硅合金活塞显微组织级别时,合金的含硅量、变质剂的加入量以及温度变化都将影响分级结果的准确性。分析了由以上因素引起的显微组织的分级误差,确定了含硅量不同时的修正因子,变质剂的加入量以及温度变化时的校核方式,并采用数理统计方法分析了测试的可靠性,最后得出该涡流检测的分级准确率可迭99%。

关 键 词:涡流检验  合金  显微组织  分级  误差分析
文章编号:1000-6656(2004)07-0372-03
修稿时间:2003年10月27

ERROR ANALYSIS OF MICROSTRUCTURE GRADE OF AL-SI ALLOY BY EDDY CURRENT TESTING
ZENG Hui.ERROR ANALYSIS OF MICROSTRUCTURE GRADE OF AL-SI ALLOY BY EDDY CURRENT TESTING[J].Nondestructive Testing,2004,26(7):372-374.
Authors:ZENG Hui
Abstract:When testing the microstructure grade of piston made of Al-Si alloy with eddy current method, the percentage of Si in the alloy, number of inoculum and enviromental temperature would affect the accuracy of grading. The grading error of microstructure caused by the factors upon were analyzed, the correction factor applied in different percentage of Si, adding number of inoculum and calibration during temperature altering were confirmed, and the reliability of the testing was analyzed by statistics. Results showed that the grading accuracy by eddy current method was upon 99%.
Keywords:Eddy current testing  Alloy  Microstructure  Grading  Error analysis
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