| 一种焊点强度可靠性的评估方法 |
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| 引用本文： | 阮春郎. 一种焊点强度可靠性的评估方法[J]. 电子产品可靠性与环境试验, 2012, 30(5): 11-16 |
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| 作者姓名： | 阮春郎 |
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| 作者单位： | 中兴通讯股份有限公司,广东深圳,518055 |
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| 摘 要： | 焊点可靠性的评估方法和试验被讨论得很多,但如何利用有限的资源来快速地评估现场应用单板长期可靠性之类的文献却很少见。从研究相关标准和文献入手,通过合理的假设和推断,设计出一种简便、适合工程应用的评估方法,并通过试验验证,从而达到了评估数以万计的单板焊点可靠性的目的。
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| 关 键 词： | 焊点 断裂 随机振动 疲劳寿命 加速 |
A Method to Evaluate the Reliability of Soldering Strength |
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| RUAN Chun-lang. A Method to Evaluate the Reliability of Soldering Strength[J]. Electronic Product Reliability and Environmental Testing, 2012, 30(5): 11-16 |
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| Authors: | RUAN Chun-lang |
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| Affiliation: | RUAN Chun-lang (ZTE Corporation, Shenzhen 518055, China) |
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| Abstract: | The method to evaluate and test the soldering reliability has been discussed a lot. However, the literature about bow to effectively evaluate the long-term reliability of PCBs in the field application is very limited. With reference to related standards, a simple evaluation method specified for engineering applications was proposed relying on reasonable hypothesis and deduction. The method has been verified by our testing result, and it can meet the requirement for effective soldering reliability evaluation for thousands of PCBs. |
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| Keywords: | solder joint crack random vibration fatigue life acceleration |
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