Copper/polypyrrole multilayer coating for 7075 aluminum alloy protection

The corrosion behavior of 7075 aluminum (Al), copper modified Al (Al/Cu), polypyrrole modified Al (Al/PPy) and copper (under layer)/polypyrrole (top layer) modified Al (Al/Cu/PPy) samples were investigated in 3.5% NaCl solution. The copper plating on aluminum was carried out from acidic copper sulphate solution by electroless method. Polypyrrole (PPy) was electrochemically synthesized on Al and Al/Cu electrodes from 0.1 M pyrrole containing 0.4 M oxalic acid solution using cyclic voltammetry technique. The films synthesized were characterized by Fourier transform infrared spectroscopy (FT-IR). The thermal stability of PPy films was investigated by thermogravimetric analysis (TGA). The surface morphologies were examined by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The corrosion behavior of samples was investigated by electrochemical impedance spectroscopy (EIS) and anodic polarization curves. The data obtained showed that the synthesis of PPy on top of the Cu layer significantly enhances the corrosion resistance of Al by exhibiting a barrier effect against the attack of corrosive environment.