| 当前SMT环境中的热门先进技术 |
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| 引用本文： | 鲜飞. 当前SMT环境中的热门先进技术[J]. 电子与封装, 2005, 5(10): 6-9 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北武汉430074 |
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| 摘 要： | 表面贴装技术自80年代以来已在电子工业中得到了广泛应用和发展,本文简要介绍了当前SMT 环境中的一些热门先进技术。
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| 关 键 词： | SMT CSP MCM 自动 X 射线检测 选择性焊接 |
| 文章编号： | 1681-1070（2005）10-06-04 |
| 收稿时间： | 2005-04-07 |
| 修稿时间： | 2005-04-07 |
Popular and Advanced Technique within Current SMT Environment |
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| Xian Fei. Popular and Advanced Technique within Current SMT Environment[J]. Electronics & Packaging, 2005, 5(10): 6-9 |
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| Authors: | Xian Fei |
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| Affiliation: | Fiberhome Telecommunication Technologies Co., Ltd, Wuhan Hubei 430074, China |
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| Abstract: | Surface Mount Technology has been developed quickly and got wide application in electronic industry since 1980, the article simply introduces popular and advanced technique within current SMT environment. |
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| Keywords: | SMT CSP MCM |
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