首页 | 本学科首页   官方微博 | 高级检索  
     

液晶显示屏包装件跌落仿真分析及结构优化
引用本文:贾杏歌,孙伟,周俊丽,魏鹏飞,贾政,荀建东.液晶显示屏包装件跌落仿真分析及结构优化[J].包装工程,2021,42(1):143-149.
作者姓名:贾杏歌  孙伟  周俊丽  魏鹏飞  贾政  荀建东
作者单位:北京京东方光电科技有限公司,北京 102600;北京京东方光电科技有限公司,北京 102600;北京京东方光电科技有限公司,北京 102600;北京京东方光电科技有限公司,北京 102600;北京京东方光电科技有限公司,北京 102600;北京京东方光电科技有限公司,北京 102600
摘    要:目的 探究液晶显示屏包装件的跌落仿真分析方法,根据仿真分析和辅助结构设计进行优化改善.方法 根据液晶显示屏的包装形式,创建显示屏包装件的3D模型,运用Ansys LS-DYNA动力学模块对包装件进行z向面跌落仿真.通过材料所受等效应力识别存在失效风险的材料,并对材料结构进行优化改善.结果 通过跌落仿真分析,发现托盘挡墙位置承受了较大应力.其中最大等效应力为67.9 MPa,大于材料屈服强度;有效塑性应变为0.046,大于材料屈服点对应塑性应变,材料存在一定破损失效风险,需要对托盘结构进行优化来增加其支撑强度.结论 通过跌落仿真分析与跌落试验对比,验证了跌落仿真方法的可靠性,通过仿真分析找到托盘较优力学结构,通过试验验证了结构的合理性.

关 键 词:Ansys  LS-DYNA  液晶显示屏  包装件  跌落仿真
收稿时间:2020/6/28 0:00:00

Simulation Analysis and Structure Optimization of LCD Display Package Drop
JIA Xing-ge,SUN Wei,ZHOU Jun-li,WEI Peng-fei,JIA Zheng,XUN Jian-dong.Simulation Analysis and Structure Optimization of LCD Display Package Drop[J].Packaging Engineering,2021,42(1):143-149.
Authors:JIA Xing-ge  SUN Wei  ZHOU Jun-li  WEI Peng-fei  JIA Zheng  XUN Jian-dong
Affiliation:Beijing BOE Optoelectronics Technology Co., Ltd., Beijing 102600, China
Abstract:The work aims to explore the drop simulation analysis method of the liquid crystal display package, and optimize and improve the auxiliary structure design according to the simulation analysis. A 3D model of the display package was created according to the packaging form of the LCD display, and the Ansys LS-DYNA dynamics module was used to simulate the Z-direction drop of the package. The material with the risk of failure was identified through the equivalent stress of the material, and the material structure was optimized and improved. Through drop simulation analysis, it was found that the position of the tray retaining wall bore a greater stress. The maximum equivalent stress was 67.9 MPa, which was greater than the yield strength of the material; the effective plastic strain was 0.046, which was greater than the corresponding plastic strain of the yield point of the material. The material had a certain risk of failure and loss. It was necessary to optimize the tray structure to increase its support strength. Through the comparison of drop simulation analysis and drop test, the reliability of the drop simulation method is verified, the better mechanical structure of tray is found through simulation analysis, and the rationality of the structure is verified through experiments.
Keywords:Ansys LS-DYNA  LCD display  packaging  drop simulation
本文献已被 CNKI 万方数据 等数据库收录!
点击此处可从《包装工程》浏览原始摘要信息
点击此处可从《包装工程》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号