| SD卡用环保塑封料研究 |
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| 引用本文： | 王殿年,李进,郭本东. SD卡用环保塑封料研究[J]. 电子与封装, 2010, 10(11): 19-21 |
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| 作者姓名： | 王殿年 李进 郭本东 |
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| 作者单位： | 长兴电子材料有限公司,江苏,昆山,215301;长兴电子材料有限公司,江苏,昆山,215301;长兴电子材料有限公司,江苏,昆山,215301 |
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| 摘 要： | 环氧塑封料是微电子工业和技术发展的基础材料,作为IC产品后道封装的三大主材料之一,随着IC封装技术的发展,IC产品未来发展趋势倾向于小体积和高性能化的方向,对其特性的要求也越来越严格。SD卡为目前流行的存储设备,长兴电子材料(昆山)有限公司开发出针对SD卡的EK5600GHL环保塑封料产品,此产品具有低吸湿率、低收缩率、高流动性及高可靠性的特点,可以满足SD卡封装要求。同时文章还介绍了SD卡用环保塑封料的测试数据、可靠性测试结果和客户端可靠性评估结果。
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| 关 键 词： | EK5600GHL 环保塑封料 高可靠性 SD卡封装 |
Research of the Green Compound of SD Card |
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| WANG Dian-nian,LI Jin,GUO Ben-dong. Research of the Green Compound of SD Card[J]. Electronics & Packaging, 2010, 10(11): 19-21 |
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| Authors: | WANG Dian-nian LI Jin GUO Ben-dong |
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| Affiliation: | WANG Dian-nian,LI Jin,GUO Ben-dong(Eternal Electronic Materials Co.Ltd,Kunshan 215301,China) |
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| Abstract: | Epoxy molding compound is the basic materials in microelectronics industrial and technological development,as one of the three main materials in the IC products molding process,with the development of IC packaging technology,its features have become increasingly stringent requirements.IC products tend to be small size in the direction of high-performance in the future,SD card shall conform to this trend of development.The green compound of EK5600GHL were developed by Eternal Electronic Materials(Kunshan) Co... |
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| Keywords: | EK5600GHL |
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