铜基复合材料中短碳纤维增强体表面镀铜的研究现状

短碳纤维增强铜基复合材料是一种极具发展前景的金属基复合材料。但是碳纤维和铜的浸润性很差,一般须对短碳纤维进行表面镀铜处理。主要介绍了短碳纤维表面电镀铜和化学镀铜工艺,从工艺流程等方面分析其优缺点,并探讨了短碳纤维化学镀铜未来的研究方向。以甲醛为还原剂得到的镀层铜纯度接近100%,以此制成的铜基复合材料的导电性也较优异,但甲醛对人体有害和污染环境。次磷酸钠还原体系的化学镀铜工艺无毒无害,但需对碳纤维进行敏化活化处理。如何简化次磷酸钠还原体系化学镀铜工艺,提高镀铜层的纯度将是今后研究发展的重点。

Present Status on Surface Copper Plating of the Short Carbon Fiber Reinforcement in the Copper Matrix Composite

The short carbon fiber reinforced copper matrix composites are a promising metal matrix composites.However,copper plating on the surface of the short carbon fiber was conducted owing to the bad wettability between copper and carbon fiber.The electroplating copper and electroless copper process of short carbon fiber were reviewed,and merits and disadvantages of its process were analyzed in order to present its future tendency.With formaldehyde as reducing agent,the purity of the plating copper reaches almost 100%.So copper matrix composites made by such process exhibits excellent conductivity.But formaldehyde is harmful for human body and resulting in environmental pollution.Electroless copper plating in which hypophosphite acts as reducing agent is avirulent and harmless,however,the carbon fiber requires sensitization and activation.In the future,the main aspects will be focused on the system of electroless copper plating with hypophosphite acts as reducing agent,especially on simplifying process and improving the purity of plating copper.