Integrated high-/spl kappa/ (/spl kappa/ /spl sim/19) MIM capacitor with Cu/low-/spl kappa/ interconnects for RF application

We demonstrate a high-performance metal-high /spl kappa/ insulator-metal (MIM) capacitor integrated with a Cu/low-/spl kappa/ backend interconnection. The high-/spl kappa/ used was laminated HfO/sub 2/-Al/sub 2/O/sub 3/ with effective /spl kappa/ /spl sim/19 and the low-/spl kappa/ dielectric used was Black Diamond with /spl kappa/ /spl sim/2.9. The MIM capacitor (/spl sim/13.4 fF//spl mu/m/sup 2/) achieved a Q-factor /spl sim/53 at 2.5 GHz and 11.7 pF. The resonant frequency f/sub r/ was 21% higher in comparison to an equivalently integrated Si/sub 3/N/sub 4/-MIM capacitor (/spl sim/0.93 fF//spl mu/m/sup 2/) having similar capacitance 11.2 pF. The impacts of high-/spl kappa/ insulator and low-/spl kappa/ interconnect dielectric on the mechanism for resonant frequency improvement are distinguished using equivalent circuit analysis. This letter suggests that integrated high-/spl kappa/ MIM could be a promising alternative capacitor structure for future high-performance RF applications.