CuW/CrCu自力型整体触头界面还原及结合强度

自力型CuW／CrCu整体弧触头的立式熔接工艺是指在立式气氛可控烧结炉内对CuW触头部分与尾部CrCu熔结的过程，是制造整体触头的关键技术。CuW／CrCu整体弧触头的立式熔接首先要对CuW合金的界面进行还原处理，以清除在熔接前由于种种原因界面上出现的氧化夹杂等，确保界面的良好结合，尾部CrCu的cr含量是影响CuW／CrCu界面结合强度的另一重要因素，适当的Cr含量是必须的。

The Interface Reduction and Bonding Strength of CuW/CrCu Self-Elastic Solid Contact

The vertical bonding process by malting in the key process for manufacturing solid contacts. The contact of CuW was bonded with the tail of CrCu by malting in a vertical atmosphere-controllable sintering furnace. The interface of CuW alloy should be treated firstly by reduction during the bonding process, in order remove the oxides impurities existed on the interface and get a good interface bonding. The Cr content of the CrCu tail is another important factor affecting the bonding strength between CuW/CrCu interface. It is necessary to have a suitable Cr content.