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高性能无卤/无铅覆铜板的制备
引用本文:黄荣辉,杨宋,李兴敏,谌香秀,肖升高. 高性能无卤/无铅覆铜板的制备[J]. 印制电路信息, 2010, 0(4): 28-30,45
作者姓名:黄荣辉  杨宋  李兴敏  谌香秀  肖升高
作者单位:苏州生益科技有限公司,江苏苏州,215024
摘    要:以苯并嗯嗪树脂(BOZ)、邻甲酚酚醛环氧树脂(CNE)、线性苯酚酚醛树脂(PN)、含磷阻燃剂以及一定量的无机填料作为树脂基体,选用适宜的溶剂,获得了加工性良好的树脂胶液,并利用差示扫描量热分析(DSC)研究了该多元体系的固化机理。通过调整树脂组分用量及优化工艺条件,制得了高耐热/湿热、低吸水率、综合性能良好的玻纤布基覆铜板,有望在“无卤无铅”化领域中得到应用。

关 键 词:苯并嗯嗪  无卤  无铅  覆铜板

Preparation of a High-performance Halogen-Free/Lead-Free Copper Clad Laminate
HUANG Rong-hui YANG Song LI Xing-min CHEN Xiang-xiu XIAO Sheng-gao. Preparation of a High-performance Halogen-Free/Lead-Free Copper Clad Laminate[J]. Printed Circuit Information, 2010, 0(4): 28-30,45
Authors:HUANG Rong-hui YANG Song LI Xing-min CHEN Xiang-xiu XIAO Sheng-gao
Affiliation:HUANG Rong-hui YANG Song LI Xing-min CHEN Xiang-xiu XIAO Sheng-gao
Abstract:Benzoxazine resin,o-cresol novolac epoxy resin,linear phenolic novolac resin,phosphorous flame-retardant and some inorganic filler were taken as resin matrix.Resin varnish with good processing properties was prepared when proper solvent was chosen.Differential Scanning Calorimetry(DSC) was used to study the curing mechanism.Copper clad laminate reinforced by glass-fiber with excellent heat-resistance,low waterabsorption and good overall performance was made when the dosage of resin was adjusted and processi...
Keywords:benzoxazine  halogen-free  lead-free  Copper Clad Laminate  
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