新型硅胶-聚合胺树脂在模拟氯化镍电解液中深度除铜

研究了新型硅胶-聚合胺复合材料树脂SP-C在模拟氯化镍电解液中深度净化除铜工艺。在Ni²⁺ 70 g/L、Cu²⁺ 0.5～2.0 g/L、pH 1～4、温度20～60 ℃的氯化镍电解液中, 考察了该树脂对铜的吸附性能, 结果表明: 随料液pH值增大以及温度升高, 铜的交换容量增大; 料液Cu²⁺浓度对交换容量影响较小; 最佳吸附条件为: 料液pH=4、接触时间30 min, 温度60 ℃。对比研究了盐酸、硫酸两种解析液, 硫酸显示出更好的解析效果, 最佳解析条件为: H₂SO₄ 2 mol/L、解析接触时间40 min。最佳工艺条件下每毫升湿树脂铜的工作交换容量及饱和交换容量分别0.453 mmol和0.540 mmol, 铜的解析峰值液浓度为28 g/L。

Deeply Removing Copper from Nickel Chloride Electrolyte with Novel Silica-polyamine Resin

The deeply removing copper process from the simulated nickel chloride electrolyte with SP-C is studied. Adsorption performance of the resin for copper is researched in the nickel chloride electrolyte which conditions of  Ni²⁺ 70 g/L, Cu²⁺ 0.5～2.0 g/L, pH 1～4, temperature 20～60 ℃. The result shows that the higher the pH and temperature, the higher the exchange capacity of the resin. Cu²⁺ composition has little  influence on exchange capcity and the optimum  adsorption condition is pH=4, contact time 30 min, temperature 60 ℃. Sulfuric acid has better desorption performance than that of hydrochloric acid by comparative study, and the optimal desorption condition is H₂SO₄ 2 mol/L, desorption contact time 40 min. Under the optimal condition, operational exchange capacity and saturate exchange capacity of per milliliter  wet resin for copper are 0.453 and 0.540 mmol respectively, the desorption peak of copper is 28 g/L in desorption solution.