| 含稀土相无铅焊点表面的锡须生长研究进展 |
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| 引用本文： | 杨橄生,于治水.含稀土相无铅焊点表面的锡须生长研究进展[J].上海工程技术大学学报,2012,26(3):267-271. |
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| 作者姓名： | 杨橄生 于治水 |
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| 作者单位： | 上海工程技术大学 材料工程学院,上海,201620 |
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| 摘 要： | 在Sn-Ag-Cu无铅钎料合金中添加稀土元素,可以显著改善钎料的综合性能,但在空气下暴露一定时间后,可能随之发生软钎焊焊点表面的“锡须生长”现象.对含稀土相软钎焊焊点表面的锡须生长及其模型进行了综述,探讨了软钎焊焊点表面锡须的生长机制及其有效的抑制方法.
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| 关 键 词： | 锡须 稀土元素 生长机制 抑制 |
Research Progress of Tin Whisker Growth on Surface of Lead-Free Solder Joints with Rare-Earth Phase |
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| YANG Gansheng
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YU Zhishui.Research Progress of Tin Whisker Growth on Surface of Lead-Free Solder Joints with Rare-Earth Phase[J].Journal of Shanghai University of Engineering Science,2012,26(3):267-271. |
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| Authors: | YANG Gansheng YU Zhishui |
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| Affiliation: | (College of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China) |
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| Abstract: | By doping Sn-Ag-Cu pb-free solder with rare-earth elements, it can obviously improve the comprehensive properties of the alloy. However, tin whisker growth phenomenons can be observed to appear on the surface of solder joints after air exposure for a period of time. Tin whisker growth model on the surface of solder joints with rare-earth phase was presented,tin whisker growth mechanism and an effective inhibition method were provided and discussed. |
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| Keywords: | in whisker rare-earth elements growth mechanism inhibition |
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