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以DMDMH和MET为配位剂的无氰镀银工艺研究
引用本文:贾晓凤,杜朝军.以DMDMH和MET为配位剂的无氰镀银工艺研究[J].表面技术,2010,39(4):59-61,72.
作者姓名:贾晓凤  杜朝军
作者单位:南阳理工学院,生物与化学工程学院,南阳,473004;南阳理工学院,生物与化学工程学院,南阳,473004
基金项目:河南省教育厅2010年度自然科学研究计划项目(2010C150003)
摘    要:研究了以Met和DMDMH为配位剂的无氰镀银工艺,通过探讨镀液组成及工艺条件对镀层外观质量的影响,确定了最佳电镀工艺。测试了镀液的阴极电流效率、分散能力、覆盖能力,以及银镀层的微观形貌和结合强度等。测试结果表明,该无氰镀银工艺基本达到了氰化物镀银工艺的相关指标,有望成为氰化物镀银的替代工艺。

关 键 词:DMDMH  蛋氨酸  无氰镀银  配位剂
收稿时间:2010/4/19 0:00:00
修稿时间:2010/8/10 0:00:00

Study on Cyanide-free Silver Electroplating Process with DMDMH and MET as Coordination Agents
JIA Xiao-feng and DU Chao-jun.Study on Cyanide-free Silver Electroplating Process with DMDMH and MET as Coordination Agents[J].Surface Technology,2010,39(4):59-61,72.
Authors:JIA Xiao-feng and DU Chao-jun
Affiliation:JIA Xiao-feng,DU Chao-jun(School of Biology , Chemical Engineering,Nanyang Institute of Technology,Nanyang 473004,China)
Abstract:A cyanide-free silver electroplating process with Met and DMDMH as coordination agents was studied.The influences of bath composition and operation conditions of the process on the appearance of silver coatings were investigated,and on this basis the optimal electroplating process was defined.It has been found by examinations of cathode current efficiency,throwing power,covering power of the bath and adhesion of the silver films that this process is the same as and even better in some aspects than cyanide p...
Keywords:DMDMH  Met  cyanide-free silver electroplating  coordination agent  
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