微波多层板基材的性能要求

介绍了微波多层板所用基材的性能参数，重点阐述了材料的介电常数、介质损耗、热胀系数、特性阻抗对多层板性能的影响。通过对微带线特性阻抗公式的理论计算，得出了带线的线宽W、导体层的厚度t、介质的厚度h以及介电常数ε1的精度对特性阻抗Z。的影响程度。这4个因素中，介质的厚度h和带线的线宽W对特性阻抗Z。的精度影响最大。总结了国内外微波介质材料的研究情况，优选了适合于制造微波多层板的材料。

Substrate Properties of Microwave Multi-layer Boards

The performance of the dielectric materials for microwave multi-layer boards (MMB)is introduced in detail. The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed. Based on theoretical calculation of characteristic impedance of microstrip, the effect of microstrip width, thickness of conductor layer and dielectric layer and accuracy of effective permittivity are investigated. The accuracy mass change of characteristic impedance is affected by width of microstrip and thickness of dielectric layer. Meanwhile, the situation to develop microwave substrate materials both at home and abroad are summarized. In addition, the dielectric materials for MMB are selected.