首页 | 本学科首页   官方微博 | 高级检索  
     

酚醛树脂固化动力学研究及其耐热性能评价
引用本文:林景雪,陶鑫,伊阳. 酚醛树脂固化动力学研究及其耐热性能评价[J]. 工程塑料应用, 2007, 35(10): 57-59
作者姓名:林景雪  陶鑫  伊阳
作者单位:中国兵器工业集团第五三研究所,济南,250031;中国兵器工业集团第五三研究所,济南,250031;中国兵器工业集团第五三研究所,济南,250031
摘    要:利用差示扫描量热(DSC)法分析了甲醛、苯酚物质的量之比为1.9:1、1.7:1、1.5:1、1.3:1时酚醛树脂(PF)的固化性能,采用Kissinger法计算了4批PF固化反应的表观活化能。用热失重分析(TG)法对4批PF的耐热性能进行了考察。试验结果表明,甲醛、苯酚物质的量之比为1.7:1时,PF的固化反应活化能最低,即固化时需要较少的热量,易固化,其耐热性能最好。

关 键 词:酚醛树  脂固化动力学  DSC  TG  耐热性
修稿时间:2007-08-02

STUDY ON THE CURING KINETCS OF PHENOLIC RESINS AND EVALUATION OF HEAT RESISTANCE
Lin Jingxue,Tao Xin,YiYang. STUDY ON THE CURING KINETCS OF PHENOLIC RESINS AND EVALUATION OF HEAT RESISTANCE[J]. Engineering Plastics Application, 2007, 35(10): 57-59
Authors:Lin Jingxue  Tao Xin  YiYang
Affiliation:CNGC Institute 53, Jinan 250031, China
Abstract:The curing properties of phenolic resins which had different ratio of substance amount of phenol to formaldehyde were analysed by using DSC method.Apparent energies of curing reaction of four phenolic resins were calculated according to Kissinger method.The heat resistance of four phenolic resins were researched by using TG method.Experiment results showed that when the ratio of substance amount of phenol to formaldehyde was 1.7:1,the curing reaction energy of phenolic resin was the lowest,it cured easily and its heat resistance was the best.
Keywords:phenolic resin  curing kinetcs  DSC  TG  heat resistance
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号