| 陶瓷表面复合电镀Ni - Ti改性及其钎焊性 |
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| 引用本文： | 张永清,任家烈,赵彭生. 陶瓷表面复合电镀Ni - Ti改性及其钎焊性[J]. 材料科学与工艺, 2005, 13(3): 291-293,298 |
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| 作者姓名： | 张永清 任家烈 赵彭生 |
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| 作者单位： | 中国科学院,电子学研究所微波器件中心,北京,100080;太原理工大学,材料科学与工程学院,山西,太原,030024;清华大学,机械工程系,北京,100084;太原理工大学,材料科学与工程学院,山西,太原,030024 |
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| 摘 要： | 为使陶瓷表面金属化,本文对陶瓷进行了Ni-Ti复合电镀.利用辉光钎焊的方法,在低真空下对复合电镀Ni-Ti陶瓷与钢板进行了无钎剂钎焊.试验表明,选用Ni作为基质金属,能够有效地缓解接头的残余应力;钎焊接头的剪切强度达到100MPa以上;在钎焊接头陶瓷一侧的界面处存在Ti的成分分布,活性元素Ti的存在增强了金属化层与陶瓷的界面反应.
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| 关 键 词： | 陶瓷 复合电镀 钎焊 |
| 文章编号： | 1005-0299(2005)03-0291-03 |
Ceramic surface modification by Ni- Ti compound plating and ceramic brazing |
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| ZHANG Yong-qing,REN Jia-lie,ZHAO Peng-sheng. Ceramic surface modification by Ni- Ti compound plating and ceramic brazing[J]. Materials Science and Technology, 2005, 13(3): 291-293,298 |
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| Authors: | ZHANG Yong-qing REN Jia-lie ZHAO Peng-sheng |
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| Abstract: | In order to metallize ceramics surface, the Ni-Ti compound plating was used. The ceramic to metal was brazed in glow discharge furnace without flux in a comparatively low vacuum degree. It was shown by experiments that Nickel, chosen as the base metal, could effectively improve residual stresses in brazing joints; the joint shear strength could reach up to more than 100MPa; a little active element Ti was found to distribute in the interfaces, which enhanced the interface reactions between ceramic and the metallizing layer. |
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| Keywords: | ceramic Ni-Ti compound plating brazing |
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