应用于微波和RF电路中的厚膜材料和工艺

介绍了应用于微波和 RF电路中的厚膜材料和工艺。无玻璃的厚膜导体材料 (如金、银等 )的电阻率极低。氧化铝 (96% ,99% )、氧化铍和氮化铝陶瓷的高频损耗很低 ,是优良的微波和 RF电路用基板。采用先进的厚膜细线技术 ,使厚膜导体的线分辨率几乎达到了薄膜工艺的水平。新开发的低损耗、低介电常数的低温共烧陶瓷 (L TCC)材料最适合做微波 MCM的基板材料。

Thick Film Material and Process Applied in Microwave and RF Circuits

Thick film material and process applied in microwave and RF circuits are offered in the paper.The resistivity of the fritless thick film conductor(Au,Ag,etc)is extremely low.With very low loss at high frequency,alumina(96%,99%),beryllium oxide(BeO)and aluminium nitride(AlN)ceramics are excellent substrates for microwave and RF circuits.With the advanced fine line thick film technology,the line resolution of thick film conductor almost reach the level of the thin film technology.The newly developed low loss,low dielectric constant and low temperature co fired ceramics(LTCC)materials are the best substrate for microwave MCM technology.