焊膏用水溶性免清洗助焊剂的研究

选用水溶性物质作为制备助焊剂的原料;以有机酸和有机胺复配为活性组分并采用丙烯酸树脂对其进行微胶囊化包覆处理;采用正交试验优化助焊剂配方,并进行回流焊接模拟.结果表明：复配活性物质可以调节焊剂pH值接近6且不降低活性.微胶囊化处理可以很好的消除腐蚀.该焊剂制备的焊膏焊接性能良好、存储寿命长.焊后残留少、无腐蚀、易水洗,焊点饱满、光亮,焊层薄而明晰.

Study on Water-soluble Cleaning-free Flux for Making Solder Paste

The water-soluble substances are selected as the raw material of flux. The active substance which is made up of organic acid and organic amine complex is micro-encapsulated with Polymethacrylates. The component of the flux is optimized by using orthogonal design method, and the reflow-soldering is simulated. The result shows that the compound active substance can adjust the pH valus of the flux to 6 with reducing its activity. The micro-encapsulation treatment can eliminate corrosion. The solder paste made with the flux has good welding performance and a long storage life. Less residue is left after soldering, without corrosion and easy to bath. The spot weld is plump and beamy. The welding layer is thin and clear.