一种用于高热功率密闭计算机散热的环路热管系统

工作在潮湿、粉尘、腐蚀等恶劣环境下的电子设备需要密封,当机箱内部元器件的总发热功率过高时急需一套有效的散热系统来保证该电子设备安全稳定地工作.文中设计了一种环路热管系统.该环路热管系统的蒸发段位于密闭机箱内部,通过工质的相变源源不断地将元器件的热量传递到位于机箱外侧的冷凝段中.若PCB上电子元器件的结温低于其上限值,则该环路热管散热系统满足要求.理论计算和数值计算表明,该环路热管散热系统能够很好地保证高热功率密闭计算机安全稳定工作.

A Loop Heat Pipe System for Heat Dissipation of Computers with Closed Chassis and High Thermal Power

Electronic equipment working in the damp, dust, corrosion and other harsh environments needs to be sealed. An effective heat dissipation system is needed to ensure that the electronic equipment works safely and stably when the total thermal power is too high. A loop heat pipe system is designed in this paper. The evaporation section of this loop heat pipe is located inside the closed chassis. The working fluid in the evaporation section can transfer the heat steadily to the condensation section of the loop heat pipe which is located out-side the closed chassis. If the junction temperature of the electronic component on the PCB is below its upper limit, the loop heat pipe meets the design requirements. The theoretical calculation and numerical calculation indicate that the loop heat pipe system can ensure the computer with closed chassis and high thermal power to work safely and stably.