A study on the characteristics of a wafer-polishing process according to machining conditions |
| |
Authors: | Jung-Taik Lee Jong-Koo Won and Eun-Sang Lee |
| |
Affiliation: | (1) School of Mechanical Engineering, INHA University, 235, Yonghyun-dong, Nam-gu, Incheon, South Korea, 402-751;(2) Department of Mechanical Engineering, INHA University, 235, Yonghyun-dong, Nam-gu, Incheon, South Korea, 402-751 |
| |
Abstract: | The polishing process for silicon wafers plays a key role in the fabrication of semiconductors, since a globally planar, mirrorlike
wafer surface is achieved in the process. The surface roughness of the wafer depends on the surface properties of the carrier
head unit, together with other machining conditions, such as working speed, type of polishing pad, temperature, and down force.
In this paper, the results of several experiments are used to study silicon wafer surfaces. The experiments were designed
to observe the down force and temperature when a wafer carrier head unit with wafer was pressed down onto a polishing pad.
A load cell was employed to detect the applied pressure against the polishing pad, and the working temperature was measured
with an infrared sensor. Wafer surface roughness was investigated according to several parameters and experimental data. |
| |
Keywords: | Wafer polishing Surface roughness Loadcell Machining properties IR sensor |
本文献已被 SpringerLink 等数据库收录! |
|