| SMT焊点元件与基板间隙的预测及其对焊点三维形态的影响 |
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| 引用本文： | 王国忠,王春青.SMT焊点元件与基板间隙的预测及其对焊点三维形态的影响[J].电子工艺技术,1997,18(2):60-62. |
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| 作者姓名： | 王国忠 王春青 |
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| 作者单位： | 哈尔滨工业大学 |
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| 基金项目： | 国家高等学校博士学科点基金 |
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| 摘 要： | 基于能量最小原理，采用三维有限元方法，考究了片式元件与基板的间隙对ＳＭＴ焊点三维开矿的影响，利用焊点系统的能量数据，分析元件与基板的间隙。研究表明，元件与基板的间隙对焊点三维形态有重要影响，元件与基板的间隙随焊点钎料量的增加和焊盘伸出长度匠减小而增加，提出了间隙与钎料量，焊盘伸出长度关系的回归模型。
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| 关 键 词： | SMT 间隙 焊点三维形态 表面组装技术 |
Prediction of Stand-off Height Between Chip Component and Substrate and its Effects on Three-dimensional Solder Joint Geometry |
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| Wang Guozhong,Wang Chunqing,Qian Yiyu.Prediction of Stand-off Height Between Chip Component and Substrate and its Effects on Three-dimensional Solder Joint Geometry[J].Electronics Process Technology,1997,18(2):60-62. |
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| Authors: | Wang Guozhong Wang Chunqing Qian Yiyu |
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| Affiliation: | Wang Guozhong Wang Chunqing Qian Yiyu |
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| Abstract: | By employing the minimum energy theorem,the effects of stand-off height(SOH)between chip component and substrate on three-dimensional(3-D)solder joint geometry were investigated with 3-D finite element method The stand-off height was analyzed with the use of potential energy data of the solder joint system The results show that SOH has important effects on solder joint geometry,the SOH increases with the increase of solder volume and the decrease of pad extension length Moreover,a regression model for the relationship between SOH,solder volume and pad extension length was put forward |
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| Keywords: | SMT Stand-off height 3-D solder joint geometry |
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