| 镀钯键合铜丝的发展趋势 |
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| 引用本文： | 康菲菲,杨国祥,孔建稳,刀萍,吴永瑾,张昆华.镀钯键合铜丝的发展趋势[J].材料导报,2011,25(21):104-107,128. |
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| 作者姓名： | 康菲菲 杨国祥 孔建稳 刀萍 吴永瑾 张昆华 |
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| 作者单位： | 贵研铂业股份有限公司,昆明,650106 |
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| 基金项目： | 昆明贵金属研究所基金(GY-10-RD03) |
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| 摘 要： | 铜丝表面镀钯是提高抗氧化性进而改善键合性能的有效手段。镀钯键合铜丝具有优异的综合性能,是半导体封装材料连接导线的新型材料。综述了镀钯键合铜丝国内外的发展现状、研究背景、镀钯工艺及金丝、铜丝和镀钯铜丝的比较。
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| 关 键 词： | 金属材料 半导体封装 镀钯键合铜丝 键合性能 |
The Development Trend of Palladium-plated Bonding Copper Wire |
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| KANG Feifei,YANG Guoxiang,KONG Jianwen,DAO Ping,WU Yongjin,ZHANG Kunhua.The Development Trend of Palladium-plated Bonding Copper Wire[J].Materials Review,2011,25(21):104-107,128. |
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| Authors: | KANG Feifei YANG Guoxiang KONG Jianwen DAO Ping WU Yongjin ZHANG Kunhua |
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| Affiliation: | (Sino-platinum Metals CO.,Ltd,Kunming 650106) |
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| Abstract: | The plating palladium on copper wire can effectively increase oxidation-resistance and then improve bonding property.The Pd-plated copper bonding wire of superior comprehensive performance will be new material suitable for connecting wire on semiconductor packaging.The developmental situation at home and abroad,the research background,the technology of palladium plating and the comparison among gold wire,copper wire and Pd-plated copper wire are reviewed. |
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| Keywords: | metal material semiconductor packaging the Pd-plated copper bonding wire bonding property |
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